SETNA ACCµRA100 Flip-chip Bonder

Overview

Flip-chip bonders are precision instruments/tools used to align and bond one or more chips onto a substrate using pressure and/or heat. In fabrication of devices, such as IR detectors, flip-chip bonding is carried out as the last step where the IR detector chip is bonded to the ROIC (read-out integrated circuit) by indium-to-indium bonding. The bonding that takes place is each pixel on the IR detector to each pixel on the ROIC. These pixels are in microns (µm) / nanometers (nm) scale. Hence precision and accuracy are crucial requirements of the flip-chip bonder.

SETNA ACCµRA100 Flip-chip Bonder has a post-bonding accuracy of ±5µm. The tool can perform accurate control in low force and temperature, under confining gas and has the capability of performing reflow process. The top chip here is automatically flipped by the tool and brough to alignment by the tools sophisticated camera system and software. It combines high precision, flexibility, easy to use, small footprint, compact design, accessibility along with repeatability due to motorized axes.

SETNA ACCµRA100 Flip-chip Bonder can carry out flip-chip bonding, die bonding, chip-to-chip as well as chip-to-substrate bonding, pick and place of chips, Thermocompression, reflow process, UV curing, melting of Indium, Gold, copper, Gold/Tin(composite), micro-assembly, Nanoimprinting (UV and hot embossing), and Mirror assembly. Its applications are in fabrication of semiconductor devices such as LEDs, photodiodes, IR detectors, LASERS, VCSELS, Prisms, Lenses and much more.