About

A Cleanroom is a space/laboratory. It is a controlled environment that filters pollutants like dust, airborne microbes, aerosol particles to provide the cleanest particle free area as possible1.​ These spaces are used for production of products like Electronic Devices, Pharmaceuticals and medical equipment 1.​ Along with particle count we also monitor temperature, airflow and humidity.​ Cleanrooms are classified depending on the number of particles in the air per cubic meter  UNM NanoFab is a Class 1000 (Bay 1,2,3) and Class 100 (Bay 4).

If you wish to be trained on cleanroom equipment, please contact: Maya Narayanan Kutty.

Hours of Operation
DayHours
Monday9:00 AM – 6:00 PM
Tuesday9:00 AM – 6:00 PM
Wednesday9:00 AM – 6:00 PM
Thursday9:00 AM – 6:00 PM
Friday9:00 AM – 6:00 PM
Weekends & HolidaysBy approval only

 

List of Tools with Manufacturer Details and Comments

Tool ID

Tool Manufacturer / Name

Comments

AB01Local Mfg N/A Acid Bench 
AB02Local Mfg N/A Acid Bench 
ALPS01Tencor Alpha Step 500 
BB01Local Mfg N/A Base Bench 
BB02Various N/A Gold Electroplating 
BB03Local Mfg N/A Developer Bench 
CVD01SAMCO PD-10 PECVDTIP
ELP01Gaertner L125B Ellipsometer 
EVAP01Airco Temescal N/A Metal I EvaporatorTIP
EVAP02Telemark N/A Metal II EvaporatorTIP
EVAP03CHA Mark 40 Dielectric EvaporatorTIP
EVAP04Sharon Vacuum N/A Thernal EvaporatorTIP
FRN01Lindberg S5357-BDS Silicon Oxidation FurnaceTIP
FRN02Lindberg S5359-BDS Silicon Diffusion FurnaceTIP
FRN05Expert Semiconductor Expertech III-V Steam Oxidation Furnace 
HTP01Dataplate 720 Series Hot Plate 
HTP02Dataplate 720 Series Hot Plate 
HTP03Dataplate 720 Series Hot Plate 
HTP04Dataplate 720 Series Hot Plate 
LAM01LAM Planar Etcher #01 
LAM02LAM Planar Etcher #02 
MA01Karl Suss MJ83 Mask Aligner 
MA03Karl Suss MJ83 Mask Aligner 
MA04Karl Suss MJ83 Mask Aligner 
MIC01Leitz Ergolutz Microscope 
MIC03Nikon UM-2 Microscope 
OVN01Blue M OV-8A Oven 
OVN02Blue M OV-8A Oven 
OVN03Blue M OV-472A-3 Oven 
OVN04Blue M OV-472A-4 Oven 
PE01PlasmaTherm/Unaxis ICPTIP
PE02Technics PEII-A Planar Etcher 
PE04Plasmaline Asher Planar Etcher 
PE05Plasma Technology PlasmalineTIP
RTA01Modular Process RTA 
RTA02Process Products 1150 RTA 
SB01Solvent Bench 
SB02Solvent Bench 
SB03Solvent Bench 
SPIN01Headway Research Spinner 
SPIN02Headway Research Spinner 
STPR01Stepper 

 

Summary of Photoresists: Manufacturers, Types, and Properties

Manuf.

Photoresist

Tone

Exposure Wavelengths (in nm)

Reference

Aspect Ratio / Resolution

Primary Uses / Applications

SDS
AZ5206-EPositive1.0 - 2.0μmi-,h-lineHigh resolution PDF
AZ5214-EPositive1.0-2.0μmi-,h-lineHigh resolution PDF
AZ5214-EIRNegative1.0-2.0μmi-,h-lineHigh resolution PDF
AZnLOF 2020Negative1.5-4.5μmi-line Lift offPDF
AZnLOF 2035Negative3.0-6.0μmi-line Lift offPDF
AZP4210Positive1.6-2.4μmh,g-line2 to 1 PDF
AZP4330-RSPositive2.5-3.8μmh,g-line2 to 1 PDF
AZP4620Positive4.7-7.1μmh,g-line2 to 1 PDF
DOWSPR 220-3.0Positive2.0-4.5μmi-line, broadband General PurposePDF
DOWSPR 510APositive.75-1.15μmi-line  PDF
DOWUltra-I 123-0.8Positive.09-.5μmi-line General PurposePDF